UNE-EN IEC 60749-20:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by Asociación Española de Normalización in November of 2020.)
Hardcopy , PDF
English
01-11-2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-8727-9
|
| Pages |
36
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| BS EN IEC 60749-20:2020 | Equivalent |
| EN IEC 60749-20:2020 | Identical |
| IEC 60749-20:2020 | Identical |
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