UNE-EN ISO 9453:2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
Hardcopy , PDF
Spanish, Castilian, English
22-04-2015
28-07-2021
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Bibliography
Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.
| Committee |
CTN 14
|
| DevelopmentNote |
Supersedes UNE EN 29453. (03/2007)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Superseded
|
| Standards | Relationship |
| NS EN ISO 9453 : 2014 | Identical |
| BS EN ISO 9453:2014 | Identical |
| I.S. EN ISO 9453:2014 | Identical |
| NEN EN ISO 9453 : 2014 | Identical |
| ISO 9453:2014 | Identical |
| DIN EN ISO 9453:2014-12 | Identical |
| EN ISO 9453:2014 | Identical |
| NBN EN ISO 9453 : 2014 | Identical |
| NF EN ISO 9453 : 2014 | Identical |
| ISO 3677:2016 | Filler metal for soldering and brazing — Designation |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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