UNE-EN ISO 9453:2021
Current
The latest, up-to-date edition.
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Hardcopy , PDF
Spanish, Castilian, English
28-07-2021
This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of:
tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
| Committee |
CTN 14
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN ISO 9453:2021-01 | Equivalent |
| ISO 9453:2020 | Identical |
| EN ISO 9453:2020 | Identical |
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