DD IEC PAS 62686-1 : DRAFT JULY 2011
Withdrawn
Withdrawn
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PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
Published date
11-23-2012
Publisher
Withdrawn date
10-27-2018
Superseded by
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Abbreviationstions
5 Technical requirements
Annex A (normative) - STACK Specification
S/0001 Issue 14
Specifies the minimum requirements for general purpose 'off the shelf' COTS integrated circuits and discrete semiconductors for high reliability applications.
| Committee |
GEL/107
|
| DocumentType |
Draft
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 62686-1:2011 | Identical |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| MIL-STD-750 Revision F:2011 | Test Methods for Semiconductor Devices |
| EN 100015-3 : 1993 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: REQUIREMENTS FOR CLEAN ROOM AREAS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
Summarise
Sorry this product is not available in your region.