DIN EN 60749-19:2011-01
Current
Current
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2011
US$71.05
Excluding Tax where applicable
Summarise this standard
AI-generated summary
| DevelopmentNote |
Supersedes DIN EN 60749. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
8
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-19 : 2003 AMD 1 2011 | Identical |
| NBN EN 60749-19 : 2004 AMD 1 2010 | Identical |
| BS EN 60749-19 : 2003 | Identical |
| I.S. EN 60749-19:2003 | Identical |
| IEC 60749-19:2003+AMD1:2010 CSV | Identical |
| UNE-EN 60749-19:2003 | Identical |
US$71.05
Excluding Tax where applicable
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