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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term 'semiconductor die' should be taken to include passive elements).

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	21
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
DIN EN 60749-19:2011-01	Identical
NF EN 60749-19 : 2003 AMD 1 2011	Identical
EN 60749-19:2003/A1:2010	Identical
UNE-EN 60749-19:2003	Identical
NBN EN 60749-19 : 2004 AMD 1 2010	Identical
IEC 60749-19:2003+AMD1:2010 CSV	Identical
SN EN 60749-19 : 2003	Identical
BS EN 60749-19 : 2003	Identical