DIN EN 60749-20:2010-04
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009
Hardcopy , PDF
German
04-01-2010
07-01-2023
INTRODUCTION
1 Scope and object
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given in the relevant specification
Annex A (normative) Methods of inspection by acoustic
tomography
Annex B (informative) Details and descriptions of test method
on resistance of plastic-encapsulated SMDs to the
combined effect of moisture and soldering heat
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Applies to semiconductor devices (discrete devices and integrated circuits). It provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices (SMDs).
| DevelopmentNote |
Supersedes DIN EN 60749. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 60749-20:2009 | Identical |
| NF EN 60749-20 : 2010 | Identical |
| BS EN 60749-20:2009 | Identical |
| I.S. EN 60749-20:2009 | Identical |
| IEC 60749-20:2008 | Identical |
| NBN EN 60749-20 : 2010 | Identical |
| UNE-EN 60749-20:2004 | Identical |
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