IEC 60749-20:2008

FOREWORD
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
  4.1 Humidity chamber
  4.2 Reflow soldering apparatus
  4.3 Holder
  4.4 Wave-soldering apparatus
  4.5 Solvent for vapour-phase reflow soldering
  4.6 Flux
  4.7 Solder
5 Procedure
  5.1 Initial measurements
      5.1.1 Visual inspection
      5.1.2 Electrical measurement
      5.1.3 Internal inspection by acoustic tomography
  5.2 Drying
  5.3 Moisture soak
      5.3.1 General
      5.3.2 Conditions for non-dry-packed SMDs
      5.3.3 Moisture soak for dry-packed SMDs
  5.4 Soldering heat
      5.4.1 General
      5.4.2 Method of heating by infrared convection or
            convection reflow soldering
      5.4.3 Method of heating by vapour-phase reflow soldering
      5.4.4 Method of heating by wave-soldering
  5.5 Recovery
  5.6 Final measurements
      5.6.1 Visual inspection
      5.6.2 Electrical measurement
      5.6.3 Internal inspection by acoustic tomography
6 Information to be given in the relevant specification
Annex A (informative) Details and descriptions of test method
                      on resistance of plastic encapsulated SMDs
                      to the combined effect of moisture and
                      soldering heat

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.