IEC 60749-20:2002
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Hardcopy , PDF
09-30-2002
09-12-2022
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.The contents of the corrigendum of August 2003 have been included in this copy.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
49
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 60749-20:2004 | Identical |
| UNE-EN 60749-20:2009 | Identical |
| BS EN 60749-20:2003 | Identical |
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