IEC 60749-20:2002/COR1:2003
Superseded
Superseded
View Superseded by
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Amendment of
Available format(s)
Hardcopy , PDF
Language(s)
English - French
Published date
08-13-2003
Publisher
Superseded date
09-12-2022
Superseded by
Free
Excluding Tax where applicable
Modification of the validity date: now put at 2007.
| Committee |
TC 47
|
| DocumentType |
Corrigendum
|
| Pages |
0
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
Summarise
Free
Excluding Tax where applicable
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