IEC 60191-2K:1981
Withdrawn
View Superseded by
Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Hardcopy , PDF
English - French, Russian
01-01-1981
06-26-2024
Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommended Values for Certain Dimensions of Drawings
of Semi-Conductor Devices and Integrated Microcircuits
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations between case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2
Incorporated into main document IEC 60191 PT2.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
This standard is part of the Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately.
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| DIN 41870-3:1982-09 | Similar to |
| DIN 41870-4:1982-09 | Similar to |
| NEN 10191-2 : 1997 | Identical |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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