IEC 60191-3B:1978
Superseded
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement
Hardcopy , PDF
English - French, Russian
01-01-1978
09-12-2022
Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits. It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.
| Committee |
TC 47/SC 47D
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| Standards | Relationship |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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