IPC 9502 : 0
Current
The latest, up-to-date edition.
PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
04-01-1999
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Electronic Industries Association
3 TERMS AND DEFINITIONS
4 APPLICATIONS AND OBJECTIVES
5 COMPONENT COMPATIBILITY REQUIREMENTS
5.1 Process Compatibility
5.2 Other Processes
6 PCB ASSEMBLY PROCESS COMPATIBILITY LIMITS
6.1 235 degree C Oven Reflow Soldering Process
6.2 220 degree C Reflow Solder Process
6.3 Wave Solder TH 180 degree C Preheat
6.4 Wave Solder TH 160 degree C Preheat
6.5 Wave Solder SM 255 degree C - 130 degree C
Spike
6.6 Wave Solder SM 255 degree C - 100 degree C
Spike
6.7 Hand Solder TH & SM
6.8 Vapor Phase 217-219 degree C Max
6.9 Cleaning Process
6.10 No Clean Process
Figures
Tables
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