NF EN 60749-3 : 2002
Withdrawn
Withdrawn
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
Published date
01-12-2013
Publisher
Withdrawn date
10-05-2021
Superseded by
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Foreword
1 Scope
2 Test apparatus
3 Procedure
4 Failure criteria
5 Summary
Verifies that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| DevelopmentNote |
Indice de classement: C96-022-3. (03/2003) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-3:2003-04 | Identical |
| EN 60749-3:2017 | Identical |
| I.S. EN 60749-3:2017 | Identical |
| IEC 60749-3:2017 | Identical |
| NBN EN 60749-3 : 2003 | Identical |
| BS EN 60749-3:2002 | Identical |
| BS EN 60749-3:2017 | Identical |
| UNE-EN 60749-3:2003 | Identical |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
Summarise
Sorry this product is not available in your region.