JEDEC JESD51-11:2001
Current
Current
The latest, up-to-date edition.
Test Boards for Through-Hole AreaArray Leaded Package ThermalMeasurements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-06-2001
Publisher
This specification covers through-hole area array leaded packages intended to be mounted on a PCB. Itdoes not cover area array packages that require sockets.
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