ASTM F 1709 : 1997 : R2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
English
15-06-2008
03-12-2023
CONTAINED IN VOL. 10.04, 2016 Defines pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
| Committee |
F 01
|
| DocumentType |
Standard
|
| Pages |
3
|
| ProductNote |
Reconfirmed 2008
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
| ASTM F 3166 : 2016 | Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023) |
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