ASTM F 1709 : 1997 : R2016
Current
The latest, up-to-date edition.
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)
English
16-05-2016
CONTAINED IN VOL. 10.04, 2016 Defines pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
| Committee |
F 01
|
| DocumentType |
Standard
|
| Pages |
3
|
| ProductNote |
Reconfirmed 2016
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Current
|
| Supersedes |
1.1This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
1.2This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
1.2.1The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
| ASTM F 3166 : 2016 | Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023) |
| ASTM E 112 : 2013 : R2021 | Standard Test Methods for Determining Average Grain Size |
| ASTM E 112 : 2013 | Standard Test Methods for Determining Average Grain Size |
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