BS EN 60749-15:2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF
English
30-06-2011
01-10-2020
Foreword
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography
Defines a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 00/203279 DC (07/2003) Supersedes BS EN 60749. (09/2005) Supersedes 09/30203267 DC. (02/2011)
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-15 : 2011 | Identical |
| IEC 60749-15:2010 | Identical |
| DIN EN 60749-15:2011-06 | Identical |
| EN 60749-15:2010/AC:2011 | Identical |
| NBN EN 60749-15 : 2011 | Identical |
| I.S. EN 60749-15:2010 | Identical |
| EN 60749-15:2010 | Equivalent |
| UNE-EN 60749-15:2011 | Identical |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
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