IEC 60749-15:2010
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF
English, English - French
28-10-2010
12-09-2022
FOREWORD
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62174. (04/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-15 : 2011 | Identical |
| NBN EN 60749-15 : 2011 | Identical |
| NEN EN IEC 60749-15 : 2011 C11 2011 | Identical |
| I.S. EN 60749-15:2010 | Identical |
| PN EN 60749-15 : 2011 AC 2011 | Identical |
| CEI EN 60749-15 : 2012 | Identical |
| DIN EN 60749-15:2011-06 | Identical |
| UNE-EN 60749-15:2011 | Identical |
| BS EN 60749-15:2010 | Identical |
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