IEC 60749-15:2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF
English, English - French, Spanish, Castilian
28-10-2010
12-09-2022
FOREWORD
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62174. (04/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-15 : 2011 | Identical |
| NBN EN 60749-15 : 2011 | Identical |
| NEN EN IEC 60749-15 : 2011 C11 2011 | Identical |
| I.S. EN 60749-15:2010 | Identical |
| PN EN 60749-15 : 2011 AC 2011 | Identical |
| CEI EN 60749-15 : 2012 | Identical |
| EN 60749-15:2010/AC:2011 | Identical |
| DIN EN 60749-15:2011-06 | Identical |
| UNE-EN 60749-15:2011 | Identical |
| BS EN 60749-15:2010 | Identical |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| I.S. EN 60749-21:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
| EN 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| 09/30209670 DC : 0 | BS EN 60749-21 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| 15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 60747-15:2010 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| BS EN 60749-21:2011 | Semiconductor devices. Mechanical and climatic test methods Solderability |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60747-5-6:2016 | Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
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