PN EN 60749-15 : 2011 AC 2011
Withdrawn
Withdrawn
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
Published date
12-01-2013
Publisher
Withdrawn date
14-04-2021
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Specifies a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60749-15:2010 | Identical |
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