IEC PAS 62174:2000
Superseded
View Superseded by
Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF
English
22-08-2000
07-02-2003
FOREWORD
1 Purpose
2 Apparatus
3 Materials
4 Procedure
5 Summary
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
| DocumentType |
Miscellaneous Product
|
| Pages |
5
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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