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IEC PAS 62174:2000

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Resistance to soldering temperature for through-hole mounted devices

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

07-02-2003

Language(s)

English

Published date

22-08-2000

FOREWORD
1 Purpose
2 Apparatus
3 Materials
4 Procedure
5 Summary

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

DocumentType
Miscellaneous Product
Pages
5
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

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£18.73
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