BS EN 62047-11:2013
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Hardcopy , PDF
English
31-10-2013
1 Scope
2 Normative References
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Test piece fabrication
Annex B (informative) - Test piece handling example
Annex C (informative) - Test piece releasing process
Annex D (informative) - Out-of-plane test setup
and test piece example
Annex E (informative) - Data analysis example in
in-plane test method
Annex F (informative) - Data analysis example in
out-of-plane test method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 10/30211446 DC. (10/2013)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material\'s melting temperature.
| Standards | Relationship |
| IEC 62047-11:2013 | Identical |
| EN 62047-11:2013 | Identical |
| I.S. EN 62047-11:2013 | Equivalent |
| UNE-EN 62047-11:2013 | Equivalent |
| ASTM E 228 : 2017 : REDLINE | Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer |
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
| EN 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
| ASTM E 289 : 2017 : REDLINE | Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry |
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