BS IEC 63011-1:2018
Current
Current
The latest, up-to-date edition.
Integrated circuits. Three dimensional integrated circuits Terminology
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
24-01-2019
Publisher
IEC63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
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