CEI EN 60749-14 : 2004
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
Hardcopy , PDF
English
01-01-2004
FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) - Normative
references to international
publications with their
corresponding European
publications
Defines various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-37. (01/2005) Supersedes CEI EN 60749. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-14:2003 | Identical |
| EN 60749-14:2003 | Identical |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| EN 60749-8:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
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