IEC 60749-14:2003
Current
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Hardcopy , PDF
English - French
07-08-2003
FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62184. (08/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
27
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| PN EN 60749-14 : 2005 | Identical |
| BS EN 60749-14:2003 | Identical |
| CEI EN 60749-14 : 2004 | Identical |
| I.S. EN 60749-14:2003 | Identical |
| NF EN 60749-14 : 2004 | Identical |
| EN 60749-14:2003 | Identical |
| NEN EN IEC 60749-14 : 2003 | Identical |
| DIN EN 60749-14:2004-07 | Identical |
| BS EN 60068-2-13:1999 | Identical |
| UNE-EN 60749-14:2004 | Identical |
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