CEI EN 60749-35 : 2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS
Hardcopy , PDF
English
01-01-2012
FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
4 Procedure
Annex A (informative) - Acoustic
microscopy check sheet
Annex B (informative) - Potential
image pitfalls
Annex C (informative) - Some
limitations of acoustic
microscopy
Annex D (informative) - Reference
checklist for presenting
applicable scanned data
Bibliography
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-87. (03/2012)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-35:2006 | Identical |
| IEC 60749-35:2006 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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