EN 60749-35:2006
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
20-09-2006
FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
3.1 Reflective acoustic microscope system
3.2 Through transmission acoustic microscope system
3.3 Reference packages or standards
3.4 Sample holder
4 Procedure
4.1 General
4.2 Equipment setup
4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet (example
only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
applicable scanned data
Bibliography
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60749-35 : 2006 | Identical |
| IEC 60749-35:2006 | Identical |
| NBN EN 60749-35 : 2007 | Identical |
| NEN EN IEC 60749-35 : 2006 | Identical |
| I.S. EN 60749-35:2006 | Identical |
| PN EN 60749-35 : 2009 | Identical |
| BS EN 60749-35:2006 | Identical |
| CEI EN 60749-35 : 2012 | Identical |
| DIN EN 60749-35:2007-03 | Identical |
| UNE-EN 60749-35:2006 | Identical |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| CEI EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| BS EN 60749-20:2009 | Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| I.S. EN 60749-20:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |