BS EN 60749-35:2006
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Hardcopy , PDF
English
30-11-2006
1 Scope
2 Terms and definitions
3 Test apparatus
3.1 Reflective acoustic microscope system
3.2 Through transmission acoustic microscope system
3.3 Reference packages or standards
3.4 Sample holder
4 Procedure
4.1 General
4.2 Equipment setup
4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
(example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
applicable scanned data
Bibliography
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 04/30117780 DC (12/2006)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
| Standards | Relationship |
| DIN EN 60749-35:2007-03 | Identical |
| I.S. EN 60749-35:2006 | Identical |
| IEC 60749-35:2006 | Identical |
| NF EN 60749-35 : 2006 | Identical |
| EN 61140:2002 | Identical |
| NBN EN 60749-35 : 2007 | Identical |
| EN 60749-35:2006 | Identical |
| UNE-EN 60749-35:2006 | Equivalent |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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