CEI EN 62258-1 : 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
Hardcopy , PDF
English
01-01-2011
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers
with or without connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-47. (08/2006) Supersedes ES 59008-1:1999-09, ES 59008-2:1999-09 and ES 59008-3:1999-09. (08/2006)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62258-1:2009 | Identical |
| EN 62258-1:2010 | Identical |
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