EN 62258-1:2010

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
   connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).