EN 60191-6-12:2011
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Published date
05-08-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Outline drawings and principle dimensions
7 Dimensions
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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