EN 60749-19:2003
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amended by
Published date
17-04-2003
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Summarise this standard
AI-generated summary
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60749-19 : 2003 | Equivalent |
| I.S. EN 60749-19:2003 | Equivalent |
| UNE-EN 60749-19:2003 | Identical |
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