EN 61189-5:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
29-09-2006
01-09-2009
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's t distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
5.1 Test 5P01: Test-board design guideline
5.2 Test 5P02: Standard mounting process
for CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
9.1 Test 5M01: Peel test method for test-board land
10 E: Electrical test methods
10.1 Test 5E01: Changes of the surface
insulation resistance caused by fluxes
10.2 Test 5E02: Surface insulation resistance,
assemblies
11 N: Environmental test methods
11.1 Test 5N01: Reflow solderability test for
soldering joint
11.2 Test 5N02: Resistance to reflow solderability
of test board
11.3 Test 5N03: Solderability test for test board land
12 X Miscellaneous test methods
12.1 Test 5X01: Liquid flux activity, wetting
balance method
12.2 Test 5X02: Paste flux viscosity - T-Bar
spindle method
12.3 Test 5X03: Spread test, liquid or extracted
solder flux, solder paste and extracted
cored wires or preforms
12.4 Test 5X04: Solder paste viscosity - T-Bar
spin spindle method (applicable to 300 Pa.s
to 1600 Pa.s)
12.5 Test 5X05: Solder paste viscosity - T-Bar
spindle method (applicable to 300 Pa.s)
12.6 Test 5X06: Solder paste viscosity - Spiral
pump method (applicable to 300 Pa.s
to 1600 Pa.s)
12.7 Test 5X07: Solder paste viscosity - Spiral
pump method (applicable to Pa.s)
12.8 Test 5X08: Solder paste - Slump test
12.9 Test 5X09: Solder paste - Solder ball test
12.10 Test 5X10: Solder paste - Tack test
12.11 Test 5X11: Solder paste - Wetting test
12.12 Test 5X12: Flux residues - Tackiness
after drying
12.13 Test 5X13: Spitting of flux-cored wire
solder
12.14 Test 5X14: Solder pool test
Bibliography
Annex ZA (normative) - Normative references to
international publications with
their corresponding European
publications
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
To be read in conjunction with EN 60068, EN 61189-1, EN 61189-2, EN 61189-3, EN 61189-4, EN 61189-5 and EN 61189-6. (02/2009)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| PN EN 61189-5 : 2010 | Identical |
| NF EN 61189-5 : 2008 | Identical |
| I.S. EN 61189-5:2006 | Identical |
| CEI EN 61189-5 : 2007 | Identical |
| DIN EN 61189-5:2007-05 | Identical |
| IEC 61189-5:2006 | Identical |
| NEN EN IEC 61189-5 : 2006 | Identical |
| NBN EN 61189-5 : 2007 | Identical |
| BS EN 61189-5:2006 | Identical |
| DS EN 61189-5 : 2006 | Identical |
| UNE-EN 61189-5:2006 | Identical |