EN 62418:2010
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Metallization stress void test
Published date
09-07-2010
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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 62418 : 2010 | Identical |
| CEI EN 62418 : 2011 | Identical |
| NF EN 62418 : 2011 | Identical |
| IEC 62418:2010 | Identical |
| NBN EN 62418 : 2010 | Identical |
| I.S. EN 62418:2010 | Identical |
| PN EN 62418 : 2010 | Identical |
| BS EN 62418:2010 | Identical |
| DIN EN 62418:2010-12 | Identical |
| UNE-EN 62418:2010 | Identical |
Summarise
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