EN IEC 62878-1:2019
Current
Current
The latest, up-to-date edition.
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Published date
06-12-2019
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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN IEC 62878-1:2019 | Identical |
| NF EN IEC 62878-1:2019 | Identical |
| CEI EN IEC 62878-1 : 2020 | Identical |
| NEN-EN-IEC 62878-1:2019 | Identical |
| IEC 62878-1:2019 | Identical |
| BS EN IEC 62878-1:2019 | Equivalent |
| UNE-EN IEC 62878-1:2019 | Identical |
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