IEC 60191-2Z:2000
Current
The latest, up-to-date edition.
Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Hardcopy , PDF
English - French
29-09-2000
FOREWORD
PREFACE
Chapter 00 - PHILOSOPHY OF MECHANICAL STANDARDIZATION
Chapter 0 - RECOMMENDED VALUES FOR CERTAIN DIMENSIONS OF
DRAWINGS OF SEMI-CONDUCTOR DEVICES
Chapter I - DEVICE OUTLINE DRAWINGS
TYPES OF SEMICONDUCTOR DEVICES GENERALLY MOUNTED IN THE
PACKAGES OF CHAPTER I
Chapter II - BASE DRAWINGS
Chapter III - CASE OUTLINE DRAWINGS
Chapter IV - GAUGE DRAWINGS
Chapter V - TABLES SHOWING ASSOCIATIONS BETWEEN CASE
OUTLINES AND BASES
OBSOLETE DRAWINGS
ADDITIONS TO THE LIST OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
| DevelopmentNote |
Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 60191-2Z : 2001 | Identical |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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