IEC 60191-6-6:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Hardcopy , PDF
English, English - French
22-03-2001
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
3.1 flanged type
3.2 type of real chip size
3.3 FLGA
3.4 material designation
3.4.1 plastic type (P-FLGA)
3.4.2 ceramic type (C-FLGA)
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also numbered as BS EN 60191-6-6. (09/2001) A Bilingual edition has been published. (01/2013) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60191 6-6 : 2002 | Identical |
| NEN EN IEC 60191-6-6 : 2001 | Identical |
| I.S. EN 60191-6-6:2001 | Identical |
| PN EN 60191-6-6 : 2002 | Identical |
| CEI EN 60191-6-6 : 2002 | Identical |
| EN 60191-6-6:2001 | Identical |
| DIN EN 60191-6-6:2002-02 | Identical |
| NF EN 60191-6-6 : 2002 | Identical |
| UNE-EN 60191-6-6:2002 | Identical |
| IEC 60191-6-3:2000 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
| IEC 60191-2X:1999 | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| IEC 60191-2R:1995 | Sixteenth supplement |
| IEC 60191-2G:1978 | Seventh supplement |
| IEC 60191-3C:1987 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement |
| IEC 60191-2V:1998 | Twentieth supplement |
| IEC 60191-2D:1971 | Fourth supplement |
| IEC 60191-2L:1982 | Eleventh supplement |
| IEC 60191-1B:1970 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement |
| IEC 60191-2F:1976 | Sixth supplement |
| IEC 60191-2K:1981 | Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-2Y:2000 | Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-1A:1969 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement |
| IEC 60191-1C:1974 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-2H:1978 | Eigth supplement |
| IEC 60191-3B:1978 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement |
| IEC 60191-2A:1967 | First supplement to Publication 191-2 (1966) Mechanical standardization of semiconductor devices - Part 2: Dimensions Part 2: Dimensions |
| IEC 60191-2B:1969 | Second supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-2W:1999 | Twenty-first supplement |
| IEC 60191-2J:1980 | Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-2S:1995 | Seventeenth supplement |
| IEC 60191-3D:1988 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement |
| IEC 60191-2C:1970 | Third supplement |
| IEC 60191-2Q:1990 | fifteenth complement |
| IEC 60191-3A:1976 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement |
| IEC 60191-2Z:2000 | Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC 60191-5:1997 | Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) |
| IEC 60191-3F:1994 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Sixth supplement |
| IEC 60191-2U:1997 | Nineteenth supplement |
| IEC 60191-2N:1987 | Thirteenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| IEC 60191-3E:1990 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fifth supplement |
| IEC 60191-2P:1988 | Fourteenth supplement |
| IEC 60191-2M:1983 | Twelfth supplement |
| IEC 60191-2E:1974 | Fifth supplement |
| IEC 60191-2T:1996 | Eighteenth supplement |
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