IEC 61192-2:2003

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Interpretation of requirements
   4.4 Antistatic precautions
5 Component preparation processes
6 Solder paste deposition process qualification
   6.1 Solder paste characteristics
   6.2 Assessment of the process
   6.3 Solder paste deposition - Screen and stencil printing
        methods - Process control limits
7 Non-conductive adhesive deposition process
   7.1 Pot life
   7.2 Inter-stage storage and handling
   7.3 Adhesive tackiness
   7.4 Assessment of the adhesive attachment process
   7.5 Adhesive deposition - Syringe dispensing method - Small
        components - Process control limits
8 Temporary masking processes
9 Component placement processes
   9.1 Assessment of the process
   9.2 Discrete components with gull-wing leads
   9.3 IC components with flat-ribbon, L- or gull-wing leads on
        two sides
   9.4 IC components with flat-ribbon, L- or gull-wing leads on
        four sides, for example, quad flat packs
   9.5 Components with round or flattened (coined) leads
   9.6 IC component packages with J-leads on two and four sides,
        for example, SOJ, PLCC
   9.7 Leadless rectangular components with metallized
        terminations
   9.8 Components with cylindrical endcap terminations
   9.9 Bottom-only terminations on leadless components
   9.10 Leadless chip carriers with castellated terminations
   9.11 Components with butt leads
   9.12 Components with inward L-shaped ribbon leads
   9.13 Flat-lug leads on power dissipating components
10 Post-placement rework
   10.1 Rework of components placed on solder paste
   10.2 Rework of components placed on non-conductive adhesive
11 Adhesive curing
12 Soldering processes
13 Cleaning processes
14 Hand placement and hand soldering, including hand
   rework/repair
15 Electrical test
Annex A (normative)
   A.1 Introduction
   A.2 Example solder fillets and alignment: flat-ribbon, L- and
        gull-wing leads
   A.3 Example solder fillets and alignment: round or flattened
        (coined) leads
   A.4 Example solder fillets and alignment: J-leads
   A.5 Example solder fillets and alignment: rectangular or
        square end leadless components
   A.6 Example solder fillets and alignment: cylindrical end cap
        terminations, for example, MELFs
   A.7 Example solder fillets and alignment: bottom-only
        terminations on leadless components
   A.8 Example solder fillets and alignment: leadless chip
        carriers with castellated terminations
   A.9 Example solder fillets and alignment: butt joints
   A.10 Example solder fillets and alignment: inward L-shaped
        flat ribbon leads
   A.11 Example solder fillets and alignment: flat-lug leads on
        power dissipating components
Figures

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.