IPC 9502 : 0
Current
The latest, up-to-date edition.
PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
English
01-04-1999
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Electronic Industries Association
3 TERMS AND DEFINITIONS
4 APPLICATIONS AND OBJECTIVES
5 COMPONENT COMPATIBILITY REQUIREMENTS
5.1 Process Compatibility
5.2 Other Processes
6 PCB ASSEMBLY PROCESS COMPATIBILITY LIMITS
6.1 235 degree C Oven Reflow Soldering Process
6.2 220 degree C Reflow Solder Process
6.3 Wave Solder TH 180 degree C Preheat
6.4 Wave Solder TH 160 degree C Preheat
6.5 Wave Solder SM 255 degree C - 130 degree C
Spike
6.6 Wave Solder SM 255 degree C - 100 degree C
Spike
6.7 Hand Solder TH & SM
6.8 Vapor Phase 217-219 degree C Max
6.9 Cleaning Process
6.10 No Clean Process
Figures
Tables
The document describes manufacturing solder process limits that components subjected to IPS-9501, IPC-9504 and J-STD-020 would survive. Optimum conditions for assembly are not included, but rather guides to assure components are not damaged. The document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. The document is intended to complement other industry documents. Note: It does not address the increased temperature of lead-free solders.
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9701 CHINESE : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9503 : 0 | MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS |
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| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |