IPC 9503 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS
English
01-04-1999
01-08-2008
1 GENERAL
1.1 Scope
1.2 Background
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Electronic Industries Association
3 APPARATUS
4 CLASSIFICATION/RECLASSIFICATION
5 PROCEDURE
6 CRITERIA
7 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION
8 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS
9 ADDITIONS AND EXCEPTIONS
Figures
Figure 1 Flow Chart
Tables
Table 1 Package Reflow Conditions
Table 2 Moisture Sensitivity Levels
Table 3 Classification Reflow Profiles
This standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly stored, packaged, and handled to avoid subsequent mechanical/thermal damage during the assembly solder reflow attachment and/or repair operation. The standard may be used to determine what classification level should be used for initial reliability qualification.
| DevelopmentNote |
Included in IPC M 109 & IPC E 500. (09/2003) Also available in CD-ROM format. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |