IPC T 50 : M
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
Available format(s)
PDF
Language(s)
English
Publisher
Superseded date
11-12-2021
Superseded by
Excluding VAT
Planned to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics.
| DevelopmentNote |
Supersedes MIL STD 429. Included in IPC C 102, IPC C 103, IPC C 105, IPC C 106, IPC C 107, IPC C 108 & IPC C 1000. (07/2009) H2008 Edition is still active in Chinese Language, See IPC T 50 CHINESE. (10/2011) K2013 Edition is still active in German Language, See IPC T 50 GERMAN. (05/2015) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
123
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| DOD-STD-2000-1 Revision B:1986 | Soldering Technology, High Quality/High Reliability (S/S by MIL-STD-2000) |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| DOD-STD-2000-4 Revision A:1987 | GENERAL PURPOSE SOLDERING REQUIREMENTS FOR ELECTRICAL & ELECTRONIC EQUIPMENT (S/S BY MIL-STD-2000) |
| MIL-STD-2166 Base Document:1984 | CONNECTION, ELECTRICAL, COMPLAINT PIN (NO S/S DOCUMENT) |
| DOD STD 2000/3 : A NOTICE 1 | CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY |
| IPC 9151 : D | PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| MIL P 28809 : A | PRINTED WIRING ASSEMBLIES |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| IPC 6017 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
| MIL-STD-1662 Revision C:1992 | Ordnance Alteration (ORDALT) Instructions, Preparation of |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IPC 7801 : 0 | REFLOW OVEN PROCESS CONTROL STANDARD |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| PD IEC/PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2222 GERMAN : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2222 FRENCH : A2010 | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
| P-MICRO:2010 | PCB MULTI-ISSUE MICROSECTION WALL POSTER |
| MIL-C-28809 Revision B:1988 | Circuit Card Assemblies, Rigid, Flexible, And Rigid Flex (No S/S Document) |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 7527 : 0 | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| IPC 9262 : 2016 | SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
| IPC J STD 003 CHINESE : B | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC SPVC-LAT1 : 2010 | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
| IPC J STD 005 RUSSIAN : A | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 004 RUSSIAN : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 600 SWEDISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 JAPANESE : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 CHINESE : G | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| IPC 9241 : 2016 | GUIDELINES FOR MICROSECTION PREPARATION |
| IPC A 600 GERMAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC A 600 POLISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 RUSSIAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 5704 : 0 | CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS |
| IPC 9592 : B | REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
| IPC 2222 CHINESE : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT) |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 4204 CHINESE : A2011 AMD 1 2013 | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 4412 : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| MIL-P-46843 Revision C:1989 | PRINTED WIRING ASSEMBLIES, PRODUCTION OF (NO S/S DOCUMENT) |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL-PRF-31032-6 Revision B:2017 | Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC 7527 GERMAN : - | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4412 CHINESE : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| MIL-PRF-31032-5 Revision B:2017 | Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications |
| IPC J STD 004 CHINESE : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 609 CHINESE : A | IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 840 CHINESE : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC PWB-CRT-SG : A2007 | PCB DESIGNERS CERTIFICATION STUDY GUIDE |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC 4202 CHINESE : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 006 CHINESE : B-2 | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 005 CHINESE : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC A 600 FRENCH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC FC 221 : A1984 | SPECIFICATION FOR FLAT COPPER CONDUCTORS FOR FLAT CABLES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC FC 213 : 1984 | PERFORMANCE SPECIFICATION FOR FLAT UNDERCARPET TELEPHONE CABLE |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS (S/S BY ASME-Y14.100, ASME-Y14.24, ASME-Y14.35M, AND ASME-14.34M) |
| DOD-STD-2000-2 Revision A:1986 | PART & COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL & ELECTRONIC ASSEMBLIES (S/S BY MIL-STD-2000) |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| DD IEC/PAS 61249-6-3:2011 | Specification for finished fabric woven from “E” glass for printed boards |
| IPC HDBK 4691 : 2015 | HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
| IPC 9194 : 0 | IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE |
| IPC QS 95 : 1993 | GENERAL REQUIREMENTS FOR IMPLEMENTATION OF ISO 9000 QUALITY SYSTEMS |
| IEC PAS 62214:2001 | Generic performance specification for printed boards |
| IPC 1072 : 2015 AMD 1 2017 | INTELLECTUAL PROPERTY PROTECTION IN ELECTRONIC ASSEMBLY MANUFACTURING |
| IPC 7525 GERMAN : B | STENCIL DESIGN GUIDELINE |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IEC PAS 61249-6-3:2011 | Specification for finished fabric woven from "E" glass for printed boards |
| IEC PAS 62213:2001 | Specification and characterization methods for nonwoven para-aramid reinforcement |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| 13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (NO S/S DOCUMENT) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC PAS 62212:2001 | Specification and characterization methods for nonwoven "E" glass mat |
| IPC 6011 GERMAN : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 6903 : A2018 | TERMS AND DEFINITIONS FOR THE DESIGN AND MANUFACTURE OF PRINTED ELECTRONICS |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| IPC 7525 CHINESE : B | STENCIL DESIGN GUIDELINES |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC HDBK 630 : 0 | GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| IPC 9707 : 0 | SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
| IPC J STD 030 : A | SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
| IPC 1751 : A2010 + A1 2012 | GENERIC REQUIREMENTS FOR DECLARATION PROCESS MANAGEMENT |
| IPC 9709 : 0 | TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING |
| MIL-STD-2118 Base Document:1984 | Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223) |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IPC AM 372 : 1978 | ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| DD IEC/PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| 12/30262664 DC | BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC FC 241 : C1992 AMD 1 1995 | FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING |
| IPC M 107 : LATEST | STANDARDS FOR PRINTED BOARD MATERIALS MANUAL |
| IPC D 319 : 1987 | DESIGN STANDARD FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC FC 210 : 1985 | PERFORMANCE SPECIFICATION FOR FLAT-CONDUCTOR UNDERCARPET POWER CABLE (TYPE FCC) |
| IPC SP 819 : 1988 | SPECIFICATION FOR SOLDER PASTES |
| IPC SF 818 : 1991 | GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES |
| IPC RF 245 : 1987 | RIGID-FLEX PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC ML 910 : A1976 | RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR, |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| IPC 1066 : 0 | MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC D 320A : 1981 | PRINTED BOARD, RIGID, SINGLE, AND DOUBLE-SIDED, END PRODUCT STANDARD |
| IPC FC 232 : C1994 AMD 1 1995 | ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 9708 : 0 | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| IPC 9708 CHINESE : - | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| MIL-STD-2119 Revision A:1990 | Design Requirements for Printed-Wiring Electrical Backplane Assemblies |
| 12/30261600 DC : DRAFT MAR 2012 | BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| IPC 9204 : 2017 | GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 1755:2014 | CONFLICT MINERALS DATA EXCHANGE STANDARD |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC 1902 : 1998 | GRID SYSTEMS FOR PRINTED CIRCUITS |
| IPC 9850A:2011 | SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION |
| IPC 2547 : 0 | SECTIONAL REQUIREMENTS FOR SHOP-FLOOR EQUIPMENT COMMUNICATION MESSAGES (CAMX) FOR PRINTED CIRCUIT BOARD TEST, INSPECTION AND REWORK |
| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| IPC 4562 CHINESE : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IEC PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| 13/30295424 DC : 0 | BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| ASME Y14.31 : 2014 | UNDIMENSIONED DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC-2231:2019 | DFX Guidelines |
| MIL-STD-883-1 Base Document:2019 | Environmental Test Methods for Microcircuits Part 1: Test Methods 1000-1999 |
| JEDEC JEP30-P100D:2024 | Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-A100B.01:2025 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| IPC FC 203 : 1985 | FLAT CABLE, ROUND CONDUCTOR, GROUND PLANE, SPECIFICATION FOR, |
| IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
| IPC AM 361 : 1982 | PRINTED BOARDS, SPECIFICATION FOR RIGID SUBSTRATES FOR ADDITIVE PROCESS, |
| IPC HF 318 : A1991 | MICROWAVE END PRODUCT BOARD INSPECTION AND TEST, |
| IPC FC 220 : C1985 | SPECIFICATION FOR FLAT CABLE, FLAT CONDUCTOR, UNSHIELDED |
| IPC SD 320 : B1986 | PERFORMANCE SPECIFICATION FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC BP 421 : 80(R1990) | GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS |
| IPC FC 240 : B1974 | SPECIFICATION FOR SINGLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC-1751B:2026 | Generic Requirements for Declaration Process Management |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC S 805 : 1985 | PRINTED CIRCUITS - SOLDERABILITY TEST FOR COMPONENT LEADS AND TERMINATIONS, |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| IPC M 104 : LATEST | STANDARDS FOR PRINTED BOARD ASSEMBLY MANUAL |
| IPC M 102 : LATEST | FLEXIBLE CIRCUITS COMPENDIUM |
| IPC L 125 : A | Specification for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
| IPC M 103 : LATEST | STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL |
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