JEDEC JEP30-T100D:2026
Current
The latest, up-to-date edition.
PartModel Thermal Guidelines for Electronic-Device Packages – XML Requirements
Hardcopy , PDF
English
01-08-2026
The JEP30 document establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
70
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP30H:2026 | PartModel Guidelines for Electronic-Device Packages – XML Requirements |
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