JEDEC JEP30H:2026
Current
The latest, up-to-date edition.
PartModel Guidelines for Electronic-Device Packages – XML Requirements
Hardcopy , PDF
English
01-08-2026
This part of JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
109
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP30-K100:2025 | PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-PX100:2025 | PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements |
| JEDEC JEP30-T100D:2026 | PartModel Thermal Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-M100:2025 | PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.