JEDEC JESD93A:2022
Current
The latest, up-to-date edition.
MULTICHIP MODULES (MCM)
Hardcopy , PDF
English
01-10-2022
This specification establishes the general requirements for Multi-Chip Modules (MCM); hereafter referred to as devices (see Terms and Definitions section).
| DocumentType |
Revision
|
| Pages |
22
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
| JEDEC JEP 131C : 2018 | POTENTIAL FAILURE MODE AND EFFECTS ANALYSIS (FMEA) |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| JEDEC JEP133C:2010 | GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS<br>ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS |
| JEDEC JESD 94B : 2015 | Application Specific Qualification Using Knowledge Based Test Methodology |
| MIL-HDBK-217 Revision F:1991 | Reliability Prediction of Electronic Equipment |
| JEDEC JESD91B:2022 | Method for Developing Acceleration Models for Electronic Device Failure Mechanisms |
| JEDEC JEP 158:2009 | 3D CHIP STACK WITH THROUGH-SILICON VIAS (TSVS): Identifying, Evaluating and Understanding Reliability Interactions |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| JEDEC JEP122H:2016 | FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES |
| JEDEC JEP148B:2014(R2019) | RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT |
| JEDEC JEP150.01:2013 | STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS |
| JEDEC JESD47L:2022 | Stress-Test-Driven Qualification of Integrated Circuits |
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