JIS C 5018:2023
Current
Current
The latest, up-to-date edition.
Evaluation method of flexible printed wiring boards for creasing and expanding processes
Published date
20-02-2023
Publisher
Sorry this product is not available in your region.
| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| JIS C 60068-1:2016 | Environmental testing -- Part 1: General and guidance |
| JIS C 5603:1993 | Terms and definitions for printed circuits |
| JIS C 6471:1995 | Test methods of copper-clad laminates for flexible printed wiring boards |
Summarise
Sorry this product is not available in your region.