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JIS C 6471:1995

Current

Current

The latest, up-to-date edition.

Test methods of copper-clad laminates for flexible printed wiring boards

Available format(s)

PDF

Language(s)

English

Published date

30-04-1995

£40.15
Excluding VAT

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This Japanese Industrial Standard specifies test methods of copper-clad laminates for flexible printed wiring boards (hereafter referred to as \"copper-clad laminates\").

DocumentType
Standard
Pages
32
ProductNote
Japanese PDF version unavailable from Intertek Inform.
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990

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JIS C 6472:1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

£40.15
Excluding VAT