JIS C 6472:1995
Current
The latest, up-to-date edition.
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
English
30-04-1995
This Japanese Industrial Standard specifies the copper-clad laminates to be used for flexible printed wiring boards (employing, polyester film or polyimide film as the base) (hereafter referred to as \"copper-clad laminates\").
| DocumentType |
Standard
|
| Pages |
9
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990
| JIS C 6471:1995 | Test methods of copper-clad laminates for flexible printed wiring boards |
| JIS C 6512:1992 | Electrodeposited copper foil for printed wiring boards |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS E 5006:2005 | Electronic equipment for rolling stock |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.