MIL-C-47224 Revision B:1993
Current
The latest, up-to-date edition.
Compound, Molding, Transfer, Epoxy Resin, Single-Component
04-01-1993
Specifies one type of single-component, epoxy resin transfer molding compound for potting, encapsulating, and embedding electrical devices requiring good thermal conductivity.
| DevelopmentNote |
B NOTICE 1 - Notice of Inactivation for New Design. B NOTICE 2 - Notice of Validation but remains Inactive for New Design. (05/2018)
|
| DocumentType |
Standard
|
| Pages |
15
|
| ProductNote |
NEW CHILD NOT 2 2018 IS NOW ADDED
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification covers one type of single-component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.
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