MIL-C-47224 Revision B Notice 2 - Validation:2018
Current
The latest, up-to-date edition.
COMPOUND, MOLDING, TRANSFER, EPOXY RESIN, SINGLE COMPONENT
English
25-04-2018
This specification covers one type of single-component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.
| DocumentType |
Notice
|
| Pages |
1
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification covers one type of single-component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.
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