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NBN EN 60749-16 : 2004

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)

Published date

12-01-2013

Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance
8 Detail specification
9 Summary

Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

DocumentType
Standard
PublisherName
Belgian Standards
Status
Current

Standards Relationship
DIN EN 60749-16:2003-09 Identical
EN 60749-16:2003 Identical
BS EN 60749-16:2003 Identical
UNE-EN 60749-16:2003 Identical
I.S. EN 60749-16:2003 Identical

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