NBN EN 60749-16 : 2004
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
Published date
12-01-2013
Publisher
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Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance
8 Detail specification
9 Summary
Detects the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| DocumentType |
Standard
|
| PublisherName |
Belgian Standards
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60749-16:2003-09 | Identical |
| EN 60749-16:2003 | Identical |
| BS EN 60749-16:2003 | Identical |
| UNE-EN 60749-16:2003 | Identical |
| I.S. EN 60749-16:2003 | Identical |
Summarise
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